Intel turned up to CES 2026 to herald the birth of the Core Ultra Series 3, a new range of chips offering “exceptional performance.” It says the mobile processors, formerly known as Panther Lake, deliver great graphics and battery life alongside the aforementioned grunt. And that, for the first time, the silicon has been certified for embedded and industrial use cases, including robotics and smart cities. But, like so many stories about Intel these days, the launch is loaded with so much subtext you’ll need a copy of Cliffs Notes to understand it.
On the face of it, these are just some snappy flagship chips, available in Core Ultra 7 and 9 ranges as well as Core X7 and X9, which ship with 12 Xe graphics cores over the usual four. Almost all of them offer 16 total cores and threads, and all bar two have total NPU performance of 50 PTOPS.
These chips are going to be famous for two key reasons: First, Intel claims they’re the most advanced chips ever manufactured in the US. Second, they’re the first to be made using Intel’s long awaited 18A process, which has dogged the company for several years. 18A was a key plank of former CEO Pat Gelsinger’s rescue plan to restore Intel to the top of the chip world. But sadly that comeback didn’t come fast enough to prevent the CEO from being (unfairly, in my mind) deposed at the end of 2024. It didn’t help that, for all of the money spent on 18A, as recently as August 2025, the company was reportedly still suffering from low yields and high defect rates.
18A is short for 18 Angstrom, a measurement that’s far smaller than the nanometers we currently use to denote transistor size in chips. 18 Angstrom is roughly equivalent to 1.8 nanometers, putting it on the same rough level as the most advanced manufacturing process — N2 — available at TSMC in Taiwan. At CES, Intel’s new CEO Lip Bu-Tan said the company was now ahead of schedule for ramping production on 18A, which could mark an important shift in the global chip market.
You should expect to see these chips show up in laptops from all the usual suspects, including HP, Acer, Lenovo, Dell, Samsung and the rest across this year.
This article originally appeared on Engadget at https://www.engadget.com/computing/ces-2026-intel-hopes-its-core-ultra-series-3-chips-are-the-start-of-a-comeback-000155611.html?src=rss
