Apple’s next-generation iPad Pro models released in 2018 will feature octa-core processors, based on Taiwanese supplier TSMC’s improved 7nm manufacturing process, according to Chinese website MyDrivers.
iPad Pro with slim bezels and no Home button rendered by Benjamin Geskin
The report, citing sources within Apple’s supply chain, claims the eight cores in the tentatively named A11X Bionic chip will include three high-performance “Monsoon” cores and five energy-efficient “Mistral” cores.
Like the A11 Bionic chip in the latest iPhone models, which is built on a 10-nanometer process, the A11X chip will reportedly feature TSMC’s integrated fan-out wafer level packaging, or InFO WLP for short.
The chip will also presumably include a next-generation M11 coprocessor and neural engine for artificial intelligence tasks, such as processing facial recognition given rumors about Face ID on 2018 iPad Pro models.
The eight-core processor should unsurprisingly result in CPU performance improvements on next-generation iPad Pro models.
Our own Chris Jenkins provided an in-depth look at the architecture of Apple’s A11 Bionic chip. He also highlighted details about TSMC’s improved 7nm process and advanced InFO packaging process for 2018.
Apple’s current 10.5-inch and 12.9-inch iPad Pro models have an A10X Fusion chip based on TSCM’s 10nm fabrication process.
In addition to gaining Face ID, next-generation iPad Pro models are expected to have an iPhone X form factor with slimmer bezels and no Home button. However, the tablets will reportedly continue to have LCD displays due to yield rates.
Related Roundup: iPad ProTags: TSMC, mydrivers.com, A11 chipBuyer’s Guide: 10.5″ iPad Pro (Caution), 12.9″ iPad Pro (Neutral)
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