Friday, March 29, 2024

New images of cover reveal more of the Huawei Ascend P8

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Over the weekend we saw some images that were supposedly of the Huawei Ascend P8 surface on the Internet. The device that was shown in those images was obscured by a case making it difficult to determine much detail or even verify that the device is the Ascend P8. A new set of leaked images has surfaced, this time for a case that is meant for the Ascend P8, and these images may provide us with a few more clues about what Huawei has planned for their forthcoming smartphone.

The images of the cover suggest the Ascend P8 will be very thin, consistent with previous information suggesting the device will only be 6 mm thick. On the right edge of the cover there are small holes consistent with volume and power buttons. More interesting is the back cover that includes a small hole in one corner and then a much larger opening centrally located in the back of the device. Sources suggest the dual openings could indicate Huawei is implementing a dual camera setup. Another alternative is that Huawei plans to include a fingerprint sensor located on the back of the device requiring an opening in any cases. The problem with that second option is that none of the previously leaked images of the device include anything like a biometric sensor on the back of the unit. Another alternative could be that Huawei just wants to leave an opening available for their branding to be shown to the world even when a case is on the smartphone.

Huawei appears to be planning to officially reveal the Ascend P8 on April 15th at an event in London.

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source: HDBlog.it
via: GSM Arena

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