Yesterday Qualcomm revealed that a “large company” had decided not to use the Snapdragon 810 in an upcoming flagship, with all signs pointing to Samsung. The reason for this change reportedly had to do with Snapdragon 810’s alleged overheating issues, something Samsung encountered in its tests of the chip. So why did Samsung run into problems and not LG? As it turns out, LG had more troubles developing the 810-powered LG G Flex 2 than it originally let on.
Despite denying that overheating was an issue a week earlier, at an LG earnings conference in South Korea LG came clean and admitted that it had ran into some issues with its “initial batch” of chips. However, LG and Qualcom have since dealt with the issues and all is on schedule both for the release of the LG G Flex 2 and the future release of the LG G4.
Despite denying that overheating was an issue a week earlier, at an LG earnings conference in South Korea LG came clean.
Speaking of the G4, LG was also asked if the latest iteration might feature a metallic body when it arrives. As you might expect, LG was pretty vague stating that “these decisions will be based on market demand.” Considering just about every OEM is now shifting to metal for flagships, we’d say the demand is there. Whether or not LG decides to follow suit is a whole other matter.
Back to the subject of overheating, providing that LG is being 100% truthful on the matter, that means other OEMs that are expected to still utilize the Snapdragon 810 (like HTC) shouldn’t experience any delays either. Let’s just hope that everything goes according to plan, both for the sake of OEMs, Qualcomm and for us consumers who want the latest and greatest without having to deal with further delays.
What do you think of the “Snapdragon 810 fiasco”, based on what we know so far? Will this hurt Qualcomm’s reputation in the long term, or will they bounce back as long as they truly have solved any performance issues by the time devices reach customers?
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